عنوان مقاله [English]
In this pIn this paper, the results of using a low energy plasma focus device MTPF-2, for investigating the destructive effects of shockwave and high-energy ions on tungsten and copper surfaces are presented. Tungsten was selected as a relatively hard metal and copper as a relatively soft metal. The samples were placed at a distance of 8 cm from the upper anode surface, at zero degrees relative to the symmetry axis, and exposed to ions and a shockwave from 20 electrical discharges. The discharge voltages were 12 kV and carried out in hydrogen gas at a pressure of 1 mbar. By using the optical microscopy images, scanning electron microscopy images, X-ray diffraction spectroscopy, and X-ray diffraction analysis, the reference and irradiated samples, were analyzed. The results of this study, in addition to confirming the performance of the MTPF-2 device to perform such studies, showed that the collision of ions and the shockwave creates, cracks and blister at the surface of the tungsten, leads to creation of cracks and blisters, and melting of the copper surface, and changing the crystalline parameters such as Bragg angles, the intensity of the peaks of the diffraction spectrum, and the distance between the crystalline plates. The calculations, which were performed by using the Scherrer’s formula, also show a change in the average grain size of both metal surfaces.